an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. advance information for pre-production products; subject to change without notice. ts3usbca4 sllsf73 ? february 2018 ts3usbca4 usb type-c sbu multiplexer with mic/agnd 1 1 features 1 ? usb type-c ? 4:1 (ts3usbca420) and 3:1 (ts3usbca410) multiplexer (mux) for analog audio mic/agnd, displayport aux, and other signals ? general purpose mux for 0 to 3.6 v differential or single-ended signals ? ultra low r on of 60 m for the agnd connections for low crosstalk performance ? low total harmonic distortion (thd) ? high bandwidth channels up to 500 mhz ? supports both pin and i 2 c configuration ? supports operation from either 3.3-v 10% regulated supply, or 2.4 to 5.5 v battery ? industrial temperature range: ? 40 o c to 85 o c ts3usbca420i and ts3usbca410i ? commercial temperature range: 0 o c to 70 o c ts3usbca420 and ts3usbca410 ? 1.8 mm x 2.6 mm, 16-pin, 0.4 mm pitch qfn package 2 applications ? tablets ? notebooks ? desktops ? gaming consoles ? vr modules 3 description the ts3usbca4 is a passive 4:1 (ts3usbca420) and 3:1 (ts3usbca410) mux supporting various types of differential or single-ended signals on the sbu1/sbu2 terminals of a usb type-c connector to different interfaces. those signals can be differential displayport auxiliary (aux), analog audio mic and agnd, pcie differential clock, or any other supported generic differential or single-ended signals. the audio path features ultra-low on-state resistance (r on ), low crosstalk and excellent total harmonic distortion (thd). the break-before-make feature prevents signal distortion during signal transfer from one channel to another. the high-speed paths support bandwidth as high as 500 mhz to provide adequate support for displayport aux, pcie clock, and other similar signals. together with low power consumption, these features make this device suitable for portable audio applications. the ts3usbca4 wide supply range from 2.4 v to 5.5 v gives users the flexibility of powering it from a single-cell battery, a 3.3-v regulator, or vbus. it also provides options for both commercial and industrial temperature ranges. device information (1) part number package body size (nom) ts3usbca4 uqfn (16) 1.80 mm 2.60 mm (1) for all available packages, see the orderable addendum at the end of the datasheet. simplified schematic type-c/pd controller usb host audio codec dp pcie up mic/gnd aux ck debug sbu dp/dm sel0,1, oen ts5usba224 ts3usbca420 usb 2.0 l/r cc copyright ? 2017, texas instruments incorporated advance information tools & software technical documents ordernow productfolder support &community
2 ts3usbca4 sllsf73 ? february 2018 www.ti.com product folder links: ts3usbca4 submit documentation feedback copyright ? 2018, texas instruments incorporated 4 device and documentation support 4.1 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 4.2 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 4.3 trademarks e2e is a trademark of texas instruments. usb type-c is a trademark of usb implementers forum. 4.4 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.5 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 5 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. advance information
package option addendum www.ti.com 22-mar-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples XTS3USBCA410RSVR active uqfn rsv 16 3000 tbd call ti call ti 0 to 70 xts3usbca420rsvr active uqfn rsv 16 3000 tbd call ti call ti 0 to 70 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
important notice texas instruments incorporated (ti) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. ti ? s published terms of sale for semiconductor products ( http://www.ti.com/sc/docs/stdterms.htm ) apply to the sale of packaged integrated circuit products that ti has qualified and released to market. additional terms may apply to the use or sale of other types of ti products and services. reproduction of significant portions of ti information in ti data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such reproduced documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyers and others who are developing systems that incorporate ti products (collectively, ? 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own risk. designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. designer will fully indemnify ti and its representatives against any damages, costs, losses, and/or liabilities arising out of designer ? s non- compliance with the terms and provisions of this notice. mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2018, texas instruments incorporated
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